ELECTRONICS

 

AURASOUND ELECTRONIC ASSEMBLY (Powered Products)

It is the policy of Aurasound to provide products and services that exceed our customer’s expectations and requirements. This goal is achieved by creating an environment where individuals continuously improve their skills to meet our customer’s present and future needs.

 

In today’s world of short product life cycles, inventory control and management issues, and competitive cost pressures - we at Aurasound are constantly challenged to be flexible and ready to respond to the customers needs. We must ensure our customer stays in a positive competitive position.

 

We understand you face fast-changing markets, short product lifecycles, rapid time-to-market requirements and low-cost strategies. You need a responsive tightly integrated supply chain. Aurasound’s flexible production system allows us to manage the entire product life-cycle, delivering the lowest total cost. Our collaborative design approach, integrated supply chain and lean manufacturing principles reduce waste and speed your time-to-market.

 

Our integrated manufacturing approach enables us to engineer your products from scratch or redesign them for cost reduction. The value we add goes beyond cost alone. We help you stay ahead of the competition.

 

Aurasound is experienced with managing multiple launches and configurations unique to different vertical markets. We have the infrastructure to manage our local and international supply base. At the factory, our teams of design, manufacturing and quality resources focus on meeting initial cost objectives and continuously strive to find new ways to drive costs out of products. With Aurasound’s style of working directly with the customer – both sides win!

 

Our design and engineering expertise allows your team to magnify your resources by relying on ours as an add-on to your team. Our team seamlessly manages and links new product introduction, printed circuit board assembly, systems build, direct fulfillment, logistics and quality assurance to help customers deal with sudden spikes in demand and meeting end-customers' needs.

 

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PCB Assembly

We are proud of our track record of extremely low defect rate on our Printed Board Assembly. We use the state-of-the-art equipment in the manufacturing and testing at our facilities to ensure your PCB units meet a stringent set of guide lines. In addition our made-to-order manufacturing is tailored for changes in product description and demands of the final product.

 

 

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Our Capabilities Include:

Through Hole Assembly

Surface Mount Assembly

Flex Circuit Assembly

Electro-Mechanical Panel Assembly

Burn-in

Thermal Stress Analysis

Repair & Test

Failure Analysis

RF Shielded line facilities

 

 

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Our Services Include:

PCB Design and Layout

Mechanical and electrical design

Conceptual design

Schematics capture

Component engineering

Design consultation

Quick-turn prototyping

Cost effective solutions for customer fabricated parts

Cost reduction analysis

DFM (Design for Manufacturability)

DFT (Design for Testability

 

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Quality

The most important step in the Aurasound approach to manufacturing is our Quality Planning phase. It is during this stage that resources, tooling, and vendors are identified. Each project is evaluated thoroughly to offer suggestions to enhance its form, function, reliability and to reduce its cost. Upon approval from the client, an internal Bill of Materials is developed, with all the approved components and vendors as specified by their AVL (Approved Vendor List).

 

Detailed work instructions with visual aids are then produced to ensure that the product will be manufactured to the highest quality standards. These work instructions also outline all inspection criteria, test parameters, ESD considerations and packaging requirements. Aurasound's approach to planning provides our clients with an unrivaled partner for their contract manufacturing needs.

 

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Capability Summary

Clean room / ESD controlled environment

Humidity Controlled facilities with Solder Paste Controls

 

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PCB

High-speed line capabilities include placement of all SMT devices, including micro BGA, CSP, flip chip, COB and 0201 components. 8-12-zone convection ovens and automated inspection systems enhance these lines.

 

 

Multiple, flexible, multi-purpose lines with a placement rate up to 21,000-cph. Automated Panel inspection

 

 

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